Dr. Ephraim Suhir is a distinguished Member of Technical Staff, Bell Laboratories, Basic Research, Physical Sciences and Engineering Research Division, USA. He is currently on the board of faculty of the Electrical Engineering Dept. University of California. He is a fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Physical Society, the Institute of Physics, UK, the American Society of Mechanical Engineers (ASME), and the Society of Plastics Engineers. He is a co-founder of the ASME Journal of Electronic Packaging and served as its technical editor for eight years (1993-2001). He has authored about 300 technical publications (patents, papers, book chapters, books). He is an editor of the Springer book series on physics, mechanics and packaging of microelectronic and photonic systems. He organized many successful conferences and symposia and presented numerous keynote and invited talks worldwide and has received many professional awards throughout his carrier. He has been recently elected as Foreign Full Member (Academician) of the National Academy of Engineering and Technological Sciences, Ukraine; as Fulbright Scholar, Council for International Exchange of Scholars (CIES), State Department, US; and as Editor, Silicon Valley Engineering Council (SVEC) Journal. He is Member of the Board of Governors and Distinguished Lecturer of the IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, Associate Editor of the IEEE CPMT Transactions on Advanced Packaging, Member of the ECTC (Electronic Components and Technology Conference) Applied Reliability Subcommittee, the IEEE CPMT award committee, the IEEE Fellow nomination committee, and the ASME General Awards committee.